TSSOP-to-DIP

About TSSOP to DIP Adapters

TSSOP-to-DIP adapters provide a reliable and convenient solution for converting Thin Shrink Small Outline Package (TSSOP) devices to Dual In-line Package (DIP) format. These adapters include a **Zero Insertion Force (ZIF) socket** for easy insertion and removal of your device, making them ideal for programming, testing, and prototyping applications. All TSSOP devices have a **0.65mm pitch** and a **4.4mm wide body**, ensuring precise alignment and compatibility.

How to Navigate

  • By Pin Count – Available in 8, 14, 16, 18, 20, 24, and 28 pin counts.
  • By Lead Pitch & Body Width – All TSSOP devices feature a **0.65mm pitch** and a **4.4mm wide body**, ensuring compatibility with the correct adapter.
  • View in Grid or Rows – Select your preferred display format for easier browsing.
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